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Ultra Low Loss High Precision FAU Fiber Array Unit For Silicon Photonics PIC CPO Optical Module 400G 800G 1.6T

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Mode Field Diameter Fiber Array

High Density Optical Connectivity

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Ultra Low Loss High Precision FAU Fiber Array Unit For Silicon Photonics PIC CPO Optical Module 400G 800G 1.6T

Brand Name:	Gracyfiber
MOQ:	100pcs
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ISO CE RoSH

Wavelength:

460,630,780,850,980,1060,1310,1550,1650,1950 Nm

Core Pitch:

127/250 μm

Insertion Loss:

≤0.5 DB (Typical 0.3 DB)

Return Loss:

UPC≥45 DB, APC≥55 DB

Operation Temperature:

-5~65 °C

Storage Temperature:

-40~85 °C

Fiberpitch:

250 µm Standard

Operatingtemperature:

-40°C To 85°C

Application:

Telecommunications, Data Centers, Optical Testing

Connectortype:

FC, SC, LC, MPO (customizable)

Operatingwavelength:

1260 Nm To 1625 Nm

Type:

Optical Fiber Array

Customization:

Available For Fiber Count, Connector Type, And Length

Returnloss:

> 55 DB

Compliance:

RoHS And REACH Compliant

Productname:

Fiber Array Solutions

Fibertype:

Single-mode And Multi-mode

Insertionloss:

< 0.3 DB

Material:

High-quality Silica Glass Fibers With Polymer Coating

Fibercount:

Up To 64 Fibers

Highlight:

Low Loss Fiber Array Unit

High Precision Fiber Array Unit

FAU Fiber Array Unit

Product Description

Ultra Low Loss High Precision Fiber Array Unit FAU For Silicon Photonics PIC CPO Optical Module 400G 800G 1.6T SM MM Coupling Solution

1. Product Overview

Gracyfiber's high-precision fiber arrays provide ultra-reliable, low-loss optical coupling solutions for next-generation silicon photonics and high-speed optical modules (400G/800G+). Designed to meet the demanding requirements of high-density optical interconnects, our fiber arrays support arrangements of up to 128 single-mode or multimode fibers with sub-micron spacing accuracy. By offering extensive customization options—from material choices (quartz, silicon, Pyrex) to various grinding angles and lidless options—we provide device-level solutions that directly help you reduce active alignment time, improve packaging yield, and accelerate time-to-market for your advanced photonic integrated circuits (PICs) and co-packaged optics (CPO) products.

2. Product Features (Key Features)

Parameter		Unit	1	2	4	8	12	16	24	32	48	64	96	128
Wavelength		nm	460,630,780,850,980,1060,1310,1550,1650,1950
Materials		-	Pyrex, Tempax, Quartz, Silicon
Lid Option			Lid / Lidless
CorePitch		-	-	250	127/250	127/250	127/250	127	127	127	127	127	127	127
Core Pitch Tolerance		μm	+/-0.3				+/-0.5				+/-0.7		+/-1.0
Polish Angle		Degree	8°,41°,82°,90° or customized (12°, 21°,...) (±0.5°)
Angle Type		-	A Type or V Type
Insertion Loss		dB	≤0.5(Typical 0.3)
Return Loss		dB	UPC≥45, APC≥55
FA Dimension	W	mm	2.5	2.5	2.5	2.5	3.5	3.5	5.7	5.7	9	10	15	19.2
	H	mm	2.5	2.5	2.5	2.5	2.5	2.5	2.5	2.5	2.5	2.5	2.5	2.5
	L	mm	10	10	10	10	10	12	12	12	12	12	15	18
	-	-	Standard or Customized
Fiber Type		-	OM1/OM2/OM3/OM4/OM5/G67A1/ A2/ B3 or Customized
Fiber Coating		um	250 µm / 900 µm loose tube / ribbon (optional)
Fiber Type Length		cm	100+/-10 or customized
Connector		-	.FC/LC/SC/E2000/MT/MPO/MMC
Operation Temperature		°C	-5~65
Storage Temperature		°C	-40~85

Features:Ultra-low insertion loss (≤ 0.5dB, typical 0.3dB) and high return loss (APC ≥ 55dB) Benefit:Maximizes your optical power budget and ensures superior signal integrity. This is crucial for extending link distances and reducing bit error rates in 400G/800G coherent networks.

Features:Submicron-level fiber pitch tolerance (down to +/- 0.3 μm) Benefit:Ensures seamless, high-yield automated active alignment with silicon photonics chips, significantly breaking manufacturing bottlenecks, reducing alignment time, and lowering overall production costs.

Features:High channel scalability (supports 1 to 128 channels) Benefit:Provides assurance for your future hardware architecture evolution. Whether it's simple end-face interconnects or high-density cabling for complex co-packaged optics (CPO) and 1.6T modules, you can smoothly upgrade your product line by relying on a single reliable supplier.

Features:Customizable grinding angles (8°, 41°, 82°, 90° or custom) and a variety of material options Benefit:Provides ultimate mechanical and optical design flexibility. You can precisely customize the grinding angle to completely eliminate back reflections and maximize optical coupling efficiency for specific optical module housing internal space constraints.

Features:Diverse termination and connector options (MT, MPO, MMC, LC, SC) Benefit:Enables seamless plug-and-play integration with existing high-density data center ecosystems, eliminating cumbersome secondary termination processes and effectively reducing your assembly steps and labor costs.

3. Applications

High-speed optical modules (Optical Transceivers): Core optical components for assembling 100G, 400G, 800G, and the emerging 1.6T modules.
Silicon Photonics (SiPh): Enables edge coupling and grating coupling in photonic integrated circuits (PICs).
Co-Packaged Optics (CPO): Used for high-density optical I/O routing near ASIC switching chips.
Passive Optical Components: Deeply integrated into wavelength selective switches (WSS), arrayed waveguide gratings (AWG), and optical splitters.
Data Center Interconnect (DCI): A fundamental solution for high-density backbone connectivity.

4. Packaging Options

We offer extremely flexible packaging and delivery configurations to perfectly match your production line process requirements:

Pigtailed
FAU
Hermetic
Lidless
Hybrid Integration Ready

Tags:

Polarization Maintaining

Fiber Collimator

Fiber Optic Coupler

PBS/PBC

Optical Isolator

Optical Circulator

CWDM Multiplexer

DWDM Multiplexer

Variable Optical Attenuator

PM Patch Cord

MPO Patch Cord

Optical Polarizer

Optical Fiber Array

PM Fiber Array

Mode Field Diameter Fiber Array

Lensed Fiber Array

2D Fiber Array

Custom Fiber Array

Network Visibility

WDM & Optical Filtering

DWDM Mux Demux

WDM Filter

FWDM

UCWDM

O-Band WDM

Reflective WDM (High ISO)

Photonic Integration

High Density Optical Connectivity

Fiber Optic Components

Polarization Maintaining

Fiber Collimator

Fiber Optic Coupler

PBS/PBC

Optical Isolator

Optical Circulator

CWDM Multiplexer

DWDM Multiplexer

Variable Optical Attenuator

PM Patch Cord

MPO Patch Cord

Optical Polarizer

Optical Fiber Array

PM Fiber Array

Mode Field Diameter Fiber Array

Lensed Fiber Array

2D Fiber Array

Custom Fiber Array

Network Visibility

WDM & Optical Filtering

DWDM Mux Demux

WDM Filter

FWDM

UCWDM

O-Band WDM

Reflective WDM (High ISO)

Photonic Integration

High Density Optical Connectivity

Fiber Optic Components

products details

Polarization Maintaining

Fiber Collimator

Fiber Optic Coupler

PBS/PBC

Optical Isolator

Optical Circulator

CWDM Multiplexer

DWDM Multiplexer

Variable Optical Attenuator

PM Patch Cord

MPO Patch Cord

Optical Polarizer

Optical Fiber Array

PM Fiber Array

Mode Field Diameter Fiber Array

Lensed Fiber Array

2D Fiber Array

Custom Fiber Array

Network Visibility

WDM & Optical Filtering

DWDM Mux Demux