Custom MFD Fiber Array 1310nm 1550nm For Silicon Photonics / Indium Phosphide

  GRACYFIBER's Mode Field Matched Single-Mode Fiber Array (SM MFD FA) is a core optical coupling component designed to completely solve the mode mismatch problem between standard single-mode fiber and photonic integrated circuits (PICs). For high-confinement waveguide devices such as silicon photonics (SiPh), indium phosphide (InP), and lithium niobate (LiNbO₃), we provide precise mode field diameter (MFD) conversion solutions through deep customization of fiber type, core parameters, and array geometry. Offering flexible lidded or lidless structures, this array is perfectly compatible with both edge coupling and butt coupling processes, significantly reducing coupling loss in optical packaging and greatly improving alignment tolerance, making it the preferred solution for high-density, low-profile photonic packaging.

(Designed to solve your optical chip coupling loss and packaging tolerance pain points)

Features: Highly customizable Mode Field Diameter (MFD) and extremely narrow tolerances

Benefit: Supports customizable MFDs within the range of 6.0 μm, 7.5 μm, 9.0 μm, or 2.6–10 μm at 1310/1550 nm wavelengths, with tolerances strictly controlled within ±0.5 μm (typical ±0.3 μm). This perfectly matches the mode field of the photonic chip's microwaveguide, greatly eliminating optical losses caused by mode mismatch and maximizing the optical power transmission efficiency of your product.

Features: Optimized ultra-low insertion loss (≤0.5 dB, typical 0.3 dB) and high return loss

Benefit:Combined with excellent return loss performance of UPC ≥45 dB and APC ≥55 dB, this feature minimizes system back reflection and saves optical power budget, which is crucial for highly sensitive coherent optical modules and precision optical sensing systems.

Features: Wide selection of specialty fibers (UHNA series and G657A1/A2)

Benefit:The array can use ultra-high numerical aperture fiber (such as UHNA1/3/4/7) or bend-resistant fiber. This not only improves coupling efficiency with miniaturized silicon photonic chips but also gives the fiber an extremely small bending radius, greatly simplifying the wiring design within the confined space of the optical module.

Features: High-precision pitch alignment and flexible channel expansion (1 to 48 channels)

Benefit: Supports 127 μm and 250 μm core pitch with tolerances as low as ±0.3 μm. This highly consistent multi-channel expansion capability helps customers quickly iterate from single-channel to 48-channel high-density photonic integration architectures without worrying about yield degradation.

Features: Diverse substrate material matching (Pyrex, Tempax, Quartz, Silicon)

Benefit: Allows customers to select the appropriate substrate based on the characteristics of their active devices. This ensures that the coefficient of thermal expansion (CTE) of the component is completely consistent with that of the silicon wafer or InP chip, guaranteeing extreme thermal stability in operating environments from -5°C to 65°C.

Our SM MFD FA is specifically designed to optimize coupling efficiency for high-order photonic integrated circuits:

• Silicon Photonics (SiPh) and InP Optoelectronics: Solves mode field mismatch issues between standard optical fibers and micro/nano waveguides.
• Co-packaged Optics (CPO) Systems: Provides low-loss optical I/O interfaces for next-generation ultra-high bandwidth switching chips.
• Lithium Niobate (LiNbO₃) Modulators: Provides a high-coupling-efficiency, low-insertion-loss physical interface.
• Coherent Optical Communication Modules: Meets the stringent optical power requirements of long-distance and metropolitan area network transmissions.
• Optical Sensing and Interferometry Systems: Ensures high stability and high signal-to-noise ratio in optical paths.

• Pigtailed
• FAU
• Hermetic
• Lidless
• Hybrid Integration Ready