1. Product Title

1–32 Channel Lidless Fiber Array for Silicon Photonics and Active Optical Alignment

2. Product Overview

The GracyFiber Lidless Fiber Array (Lidless FA) is a multi-channel optical interface designed for precise fiber alignment in photonic packaging, optical modules, and active alignment systems. Unlike a conventional covered fiber array, its lidless structure provides direct access to the exposed fiber region, supporting optical inspection, active alignment, and integration into compact photonic assemblies.

3. Key Features

• 1 to 32 fiber channels
• 127 μm and 250 μm core-pitch configurations
• Core-pitch tolerance down to ±0.3 μm
• Lidless structure for direct fiber access during alignment and inspection
• Insertion loss ≤0.5 dB, typical 0.3 dB
• Supports 8°, 41°, 82°, 90°, and customized polish angles
• Supports OM1–OM5 and G.657-series fibers
• Multiple connector options including FC, LC, SC, E2000, MT, MPO, and MMC

The supplied product description specifically identifies high-precision core pitch, low insertion loss, high return loss, multi-wavelength operation, and support for OM1–OM5 and G.657-series fibers.

4. Applications

• Silicon Photonics Packaging & Testing
• Active Optical Alignment Processes
• High-Density Optical Modules
• Optical Sensing & Measurement Systems
• Telecom & Data Communication Devices
• Laboratory & R&D Photonic Platforms
• Custom Integrated Optical Subsystems

These application areas are directly specified in the supplied Lidless Fiber Array documentation.

5. Technical Specifications

General Specifications

The DOCX independently confirms the Lidless FA's multi-wavelength capability and compatibility with OM1–OM5 and G.657-series fibers.

Core Pitch by Fiber Count

Core Pitch Tolerance

Standard Fiber Array Dimensions

Custom FA dimensions are also listed as available in the supplied specification.

6. Configuration & Customization Options

Available Options

The lidless design itself is intended to provide direct fiber access for alignment, inspection, and photonic packaging integration.

7. Detailed Product Description

The GracyFiber Lidless Fiber Array is designed around an open fiber-array structure that leaves the relevant fiber region directly accessible rather than fully enclosing it under a conventional lid. This configuration is useful in photonic packaging processes where engineers need physical or optical access to the fibers during active alignment, inspection, coupling optimization, or subsystem integration.

The product family supports 1 to 32 fibers with channel-dependent pitch configurations. A 250 μm pitch is specified for the 2-fiber version, 127 μm or 250 μm options are available for selected 4-, 8-, and 12-fiber arrays, while 16-, 24-, and 32-fiber configurations use 127 μm pitch. Core-pitch tolerances are specified at ±0.3 μm for 1–8 fiber versions and ±0.5 μm for 12–32 fiber versions.

Optical interface geometry can also be adapted to different coupling architectures. Available polishing configurations include 8°, 41°, 82°, 90°, and customized angles, with a specified angular tolerance of ±0.5°. This allows the fiber end geometry to be selected according to the corresponding optical or photonic interface.

Insertion loss is specified at ≤0.5 dB with a typical value of 0.3 dB. Return loss is specified at ≥45 dB for UPC and ≥55 dB for APC.

The Fiber Array supports both multimode and single-mode configurations, including OM1 through OM5 and G.657-series fibers. With different substrate materials, fiber protection formats, connector interfaces, fiber lengths, and mechanical dimensions available, the platform can be configured for different photonic packaging and optical-system integration requirements.

8. Application Scenario

Application 1 — Silicon Photonics Packaging and Testing

Silicon photonics devices require optical fibers to be accurately positioned relative to optical coupling structures during assembly and testing.

The lidless structure provides direct access to the fibers, allowing the array to be incorporated into active alignment and inspection processes before the final optical assembly is fixed. The available pitch, polish-angle, fiber-type, and mechanical configurations allow the FA to be matched to different photonic packaging architectures.

Silicon photonics packaging and testing are explicitly identified as applications for this product.

Application 2 — Active Optical Alignment

During active alignment, optical power or another optical parameter is monitored while the fiber interface is positioned relative to an optical device.

The open structure of the Lidless Fiber Array allows direct access to the fiber region, making it suitable for configurations where alignment, inspection, or integration steps must be performed around the fiber interface.

Application 3 — High-Density Optical Modules

Multi-channel optical modules require compact and controlled fiber routing within limited package dimensions.

The Lidless FA supports up to 32 fibers, including 127 μm pitch configurations for higher channel counts. Its standard mechanical width increases with fiber count while maintaining a 1.5 mm height across the listed configurations, supporting compact multi-fiber integration.

High-density optical modules are one of the documented product applications.

9. FAQ

1. What is a lidless fiber array?

A lidless fiber array is a fiber-array configuration in which the fiber region remains directly accessible rather than being fully covered by a conventional lid. In this product, the lidless structure is intended to support active alignment, optical inspection, and integration into high-density photonic packages.

2. What fiber counts and core pitches are available?

The supplied configuration supports 1, 2, 4, 8, 12, 16, 24, and 32 fibers. Depending on fiber count, core-pitch options include 127 μm and 250 μm. For a specific photonic interface, please provide the required fiber count and pitch for configuration review.

3. Can the Lidless Fiber Array be customized for silicon photonics applications?

Yes. The supplied specification includes options for different wavelengths, fiber counts, substrate materials, core pitches, polish angles, fiber types, fiber protection formats, fiber lengths, connectors, and FA dimensions. Silicon photonics packaging and testing are specifically listed applications.

10. Why GracyFiber

GracyFiber supplies passive optical components and fiber-interconnect products covering areas such as:

• Fiber Arrays and FAUs
• Lidless Fiber Arrays
• Lens Fiber Arrays
• PM Fiber Arrays
• MPO/MTP assemblies
• WDM components
• Polarization-maintaining passive components

For the Lidless Fiber Array, the supplied product configuration supports multiple channel counts, fiber pitches, substrate materials, polish angles, fiber types, connector interfaces, and mechanical dimensions. This allows the fiber-array interface to be specified around the requirements of the optical package rather than using a single fixed configuration.

11. Related Products

12. Call to Action

For a Lidless Fiber Array RFQ or engineering evaluation, please provide:

• Fiber count
• Operating wavelength
• Core pitch
• Fiber type
• Required polish angle
• UPC / APC requirement
• Substrate material
• Fiber coating or protection type
• Fiber length
• Connector type
• Required FA dimensions
• Target insertion loss / return loss
• Optical chip or coupling-interface drawing
• Application and alignment method

GracyFiber can use these parameters to determine the appropriate Lidless Fiber Array configuration for your project.