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MT-FA MT Fiber Optic Array For Optical Interconnect / Silicon Photonics

MT-FA MT Fiber Optic Array For Optical Interconnect / Silicon Photonics

Brand Name: Gracyfiber
MOQ: 100pcs
Payment Terms: T/T
Detail Information
Place of Origin:
China
Certification:
ISO CE RoSH
Name:
Fiber Optic Array
Connector Type:
MT
Fiber Mode:
SM/MM
Insertion Loss:
≤0.50 DB (Standard), ≤0.35 DB (Elite)
Return Loss:
≥60 DB (SM), ≥20 DB (MM)
Operation Temperature:
-40~60°C
Storage Temperature:
-40~85°C
Highlight:

MT Fiber Optic Array

,

MT-FA Fiber Optic Array

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Optical Interconnect Fiber Optic Array

Product Description

MT-FA MT Fiber Array For Optical Interconnect, Silicon Photonics, And High-Density Optical Packaging

1. Product Description

The MT-FA is an MT-type fiber optic array assembly designed for high-density optical interconnects and precision photonic packaging applications. It is suitable for silicon photonic chips, PIC devices, optical modules, parallel optical interconnects, and various high-channel optical interfaces. As part of Gracyfiber's fiber optic array series, the MT-FA is primarily used to achieve high-precision array coupling between multi-core fibers and chips, devices, or modules, helping customers improve assembly efficiency, channel consistency, and system integration. Public information indicates that Gracyfiber categorizes the MT-FA as part of its photonic integration-related product solutions, emphasizing that this type of product is suitable for precision optical alignment, optical manufacturing, and photonic packaging scenarios.

2. Key Features
Performance Level Standard Elite
Connector Mode Endface IL(max) (dB) RL(min) (dB) IL(max) (dB) RL(min) (dB)
MT SM 12F/APC ≤0.50 ≥60 ≤0.35 ≥60
MM 12F/PC ≤0.50 ≥20 ≤0.35 ≥20
Note:
  • Test wavelength: SM@1310/1550nm, MM@850/1300nm;
  • Standard conformance: GR-326, GR-1435.
Environment Conditions
Item Criteria Conformance
Operation Temperature -40~60°C IEC 61753-1
Storage Temperature -40~85°C
  • MT interface fiber array design
  • Suitable for high density optical interconnect
  • Optimized for silicon photonics and PIC coupling
  • Supports fast alignment and compact packaging
  • Designed for stable multi-channel optical connection
  • Suitable for OEM customized and integration projects
3. Applications
  • Silicon Photonics
  • PIC Packaging
  • Optical Interconnect
  • Optical Engine
  • Coherent Modules
  • Data Center Optics
  • Board-Level Optical Connection
  • OEM Photonic Integration