| Brand Name: | Gracyfiber |
| MOQ: | 100pcs |
| Payment Terms: | T/T |
Ultra-Compact Lidless PM Fiber Array Quartz V-Groove 1-64CH 127um Pitch High ER Polarization Maintaining Array For Silicon Photonics Coherent Modules OEM
High-quality polarization-maintaining lidless fiber arrays. These products are typically made of quartz and feature an extremely compact design (no top cover), making them particularly suitable for integrated optics applications with thickness or space constraints.
Key Features:
Ultra-thin/Lidless Design: Eliminating the cover plate of traditional fiber arrays reduces the overall profile height, facilitating optical path coupling in confined spaces.
High Pitch Accuracy: Pitch accuracy < 0.7µm.
Polarization Maintaining Performance: Precise alignment of the polarization axis of the polarization-maintaining fiber (typically Orientation II) ensures polarization stability.
Flexible Configuration:
Number of Channels: Available in 2, 4, 8, and 16 channels.
Fiber Spacing: 127µm or 250µm.
Polishing Angle: 0 degrees (flat) or 8 degrees (bevel).
Fiber type: Supports polarization-maintaining fibers of different wavelengths, such as PM1550 and Nufern PM780-HP.
Connectors: Typically equipped with FC/APC or FC/PC connectors.
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Material |
Quartz& Silicon |
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V-groove core pitch |
μm |
127/250/500(±0.5)or customer specified |
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wavelength |
|
460 780 980 1060 1310 |
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Polishing angle |
degree |
90°(±0.3°) |
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Number of channels |
1 |
2 |
4 |
8 |
16 |
32 |
64 |
|
|
Channel spacing |
μm |
|
250 |
127 |
127 |
127 |
127 |
127 |
|
Package |
mm |
6x2.5x2.5 |
10x2.5x2.5 |
10x2.5x2.5 |
10x2.5x2.5 |
12x3.5x2.5 |
12x5.7x2.5 |
12X9.7X2.5 |
|
Extinction ratio |
dB |
≥25 |
≥25 |
≥23 |
≥21 |
≥20 |
≥16 |
≥15 |
|
PM Fiber Alignment |
PM orientation Ⅱ |
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Fiber Type |
Corning PM15-U25D |
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|
Fiber Length |
1+/-0.1m |
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Connector |
FC/APC(Slow Axis Alignment Key) |
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Operating Temperature (℃) |
-5~65 |
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Storage Temperature (℃) |
-40~85 |
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Array Waveguide Gratings (AWG)
Planar Splitters / PLC Splitters
Integrated Fiber Optic Components
Especially suitable for edge or surface coupling of silicon photonic chips.
For coherent communication modules requiring extremely low profile packaging.